Dynamic Process Group resizes, or cores various types of wafers, including silicon wafers, up to 450mm in diameter into smaller wafers. We core all standard sized wafers; 25.4mm, 50.8mm, 76.2mm, 100mm, 150mm, 200mm, 300mm, and 450mm. Patterned and blank wafers can be cut to any geometry or size; round, square, notched, flat on the bottom, multiple flats, etc.
We core silicon, germanium, gallium arsenide, indium phosphide, graphite, silicon carbide, diamond coated wafers, stainless steel wafers, and many others.